- Printed: January 2024.
- Pages: 330
- Tables: 22
- Figures: 25
- Collection: Electronics
The worldwide panorama of semiconductor manufacturing is quickly evolving, with superior packaging rising as a vital part of producing and design. It impacts energy, efficiency, and value on a macro degree, and the essential performance of all chips on a micro degree. Superior packaging permits for the creation of sooner, cost-effective methods by integrating varied chips, a way that is more and more important given the bodily limitations of conventional chip miniaturization. It is reshaping the business, enabling the mixing of various chip sorts and enhancing processing speeds.
The U.S. authorities acknowledges the significance of superior packaging and has launched a $3 billion Nationwide Superior Packaging Manufacturing Program geared toward establishing high-volume packaging amenities by the top of the last decade. The deal with packaging enhances the prevailing efforts underneath the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.
The World Marketplace for Superior Semiconductor Packaging 2024-2035 gives a complete evaluation of the worldwide superior semiconductor packaging applied sciences market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values within the billions (USD) by kind, area, and end-use software.
Developments analyzed embody heterogeneous integration, interconnects, thermal options, miniaturization, provide chain maturity, simulation/information analytics. Main firms profiled embody TSMC, Samsung, Intel, JCET, Amkor. Functions lined embody AI, cellular, automotive, aerospace, IoT, communications (5G/6G), excessive efficiency computing, medical, and client electronics.
Regional markets explored embody North America, Asia Pacific, Europe, China, Japan, and RoW. The report additionally assesses drivers like ML/AI, information facilities, EV/ADAS; challenges like prices, complexity, reliability; rising approaches like system-in-package, monolithic 3D ICs, superior substrates, novel supplies. General an in-depth benchmark evaluation of the alternatives throughout the advancing semiconductor packaging business.
Report contents embody:
- Market measurement and forecasts
- Key know-how traits
- Progress drivers and challenges
- Aggressive panorama evaluation
- Future packaging traits outlook
- In-depth evaluation of wafer degree packaging (WLP)
- System-in-Package deal (SiP) and heterogeneous integration
- Monolithic 3D ICs overview
- Superior semiconductor packaging functions throughout key markets: AI, cellular, automotive, aerospace, IoT, communications, HPC, medical, client electronics
- Regional market breakdown
- Evaluation of key business challenges: complexity, prices, provide chain maturity, requirements
- Firm profiles: Methods and applied sciences of 90 key gamers. Firms profiled embody 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Company, Chief-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Field, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Firm (TSMC) and Yuehai Built-in.
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