EV Group (EVG), a number one provider of wafer bonding and lithography tools for the MEMS, nanotechnology and semiconductor markets, at present introduced that it has accomplished development work for the following enlargement part of its company headquarters. The brand new “Manufacturing V” facility, which is now open and serves because the manufacturing division for EVG tools parts, gives a big enhance in manufacturing ground and warehouse house. The opening of the Manufacturing V facility is the most recent in a sequence of enlargement phases and investments pushed by continued sturdy demand for EVG’s hybrid bonding and different course of options and course of improvement providers to assist the quickly rising superior packaging and 3D/heterogeneous integration market.
EVG’s state-of-the-art Manufacturing V facility provides greater than 1200 m2 of further manufacturing ground house (for a complete of greater than 8100 m2 of manufacturing space), and greater than 1200 m2 of warehouse house. Two new flooring of workplace house have additionally been added above the manufacturing ground. In parallel, the present Manufacturing II constructing was transformed to supply 9 new check rooms for the ultimate meeting and check of EVG’s high-precision programs, in addition to for technical supply inspection of the programs by EVG’s clients. This has resulted in a 30 p.c enhance in check room space, bringing the full check room house at EVG’s headquarters to just about 2,800 m2.
The opening of EVG’s Manufacturing V facility follows on the heels of the corporate’s earlier enlargement part, Manufacturing IV (accomplished on the finish of final 12 months), which itself added almost 1800 m2 of manufacturing house and extra warehouse house. Since embarking on these two most up-to-date development phases, EVG has expanded its manufacturing capability by greater than 60 p.c. Manufacturing VI, EVG’s subsequent part of enlargement that gives for an extra 1,400 m2 of manufacturing and an equal quantity of warehouse house, is already underneath development, with completion scheduled for the second half of 2024.
In response to Dr. Werner Thallner, government operations and monetary director and member of the manager board at EV Group, “New functions fueling the semiconductor trade, resembling AI, high-performance computing and autonomous driving, require huge improvements in superior packaging. As key course of enablers for 3D/heterogeneous integration, fusion and hybrid bonding have been remodeled into the brand new scaling mechanism for semiconductor manufacturing. EVG is on the forefront in growing fusion and hybrid bonding and different course of options that our clients have to assist their present and future capability ramps in addition to their long-term product roadmaps. The expansion in demand for our merchandise through the years has led us to make main investments in increasing EVG’s manufacturing and cleanroom capability to satisfy our clients’ evolving wants. We absolutely anticipate this demand development to proceed within the years forward.”
Supply: https://www.evgroup.com/
