This paper presents a novel on-chip microelectromechanical system (MEMS) that may notice in-situ quantitative mechanical testing of nanostructures underneath tension-compression capabilities. The gadget integrates pressure and compression electrostatic actuators with reverse driving orientations in a help system, enabling environment friendly measurement discount whereas retaining actuation capabilities. Mechanical properties of three sorts of nanostructures fabricated utilizing targeted ion beam (FIB) methods had been investigated with the introduced on-chip testing system. Outcomes declare that Pt nanopillars and C nanowires seem plastic deformation conduct underneath pressure take a look at, with common Younger’s moduli of 70.06 GPa and 58.32 GPa, respectively. Within the compression take a look at, the Pt nanopillar exhibited in-plane buckling conduct with a yield power of 912 MPa and Younger’s modulus of 68.81 GPa. The C nanowire displayed 3D twisting conduct with a most pressure of 25.47%, indicating distinctive flexibility. Furthermore, the uneven conduct of the C nanospring is revealed throughout 5 loading-unloading tension-compression deformation checks. This on-chip MEMS gadget gives a promising resolution for mechanical testing of nanostructures, with potential purposes in nanotechnology analysis.
